C7401 copper conductor is a practical alternative to precious metal materials in many applications. C7401 has been proven to resist ENIG plating solutions on alumina substrates. The advanced powder technology in C7401 results in improved fired film properties.
Key Features
Exceptionally high conductivity Migration resistant ENIG plateable on alumina
Metal
Cu
Viscosity
120 – 180 Kcps, Brookfield HBTSC4 – 14 spindle and 6R cup at 10 rpm, 25 °C
Process Temperature (TDS)
Fire in Nitrogen with O2 between 2 – 10 ppm 900 ºC peak Dwell time of 9 – 10 minutes Typical rise time of 20 – 23 minutes (measured from 100 ºC entry point) Total cycle time of 50 – 65 minutes