C7403C - C7404C

Description

C7403C / C7404C is a ENIG plateable, wire bondable copper conductor system developed for applying thick layers of copper. It is optimized for 96% alumina. It is intended for use where cost sensitive applications involving high thermal and electrical properties are required.C7403C / C7404C are applied by screen printing dried in air and fired in a nitrogen atmosphere C7403C is applied by printing as the base layer. C7404C is printed on top of C7403C to build up to optimal thickness.

Key Features

Compatible with Al2O3#Excellent electrical and thermal properties#Excellent fired film density#High fired film thickness (up to 300 um) ENIG and ENEPIG plateable#Wire bondable-thick Al wire

Metal

Cu

Viscosity

C7403C: 150 – 250 kcps, C7404C: 150 – 250 kcpsBrookfield HBT, SC4-14 @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 3 months from date of manufacturing with proper storage.

Process Temperature (TDS)

Fire in Nitrogen with O2 between 2-10 ppm 890 ºC peak. Dwell time of 8-10 minutes.