C8710M

Description

C8710M is an unfritted Ag conductor designed for thick print applications. In a single print and fire application, C8710M yields a thick, dense film that is free from listers, cracks, and other cosmetic defects. It exhibits excellent solderability and low resistivity. C8710M has good adhesion when printed over a base layer of C4740L or other silver based Heraeus conductors. It is not designed to be used without a base layer. C8710M is an excellent choice for low cost, high conductivity applications that require very thick conductor traces.

Key Features

Low resistivity
Good cosmetics up to 80 µm
Excellent solderability

Metal

Ag

Viscosity

180 – 220 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

Low resistivity
Good cosmetics up to 80 µm
Excellent solderability

Drying Temperature

150 °C for 10 - 20 minutes

Process Temperature (TDS)

850°C peak temperature
Dwell time of 8-12 minute

Film Thickness

Dried: 100 – 120 µm Fired: 50 – 70 µm (over a 12-14 micron print of C4740L)