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- C8717E
C8717E
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C8717E is a pure Ag conductor that yields a smooth, dense film on alumina. The material was designed for thick print applications and a fired film thickness can be achieved up to 200 μm.C8717E is recommended for power hybrid applications where high current is a requirement. C8717E is an excellent choice for high conductivity applications that require very thick conductor tracks.
Key Features
Excellent fired film density
Low resistivity, excellent solderability
Al thick wire bondable
High adhesion on alumina
Low resistivity, excellent solderability
Al thick wire bondable
High adhesion on alumina
Metal
Ag
Viscosity
45 – 70 Pa·s (25°C, D = 75/s)
Coverage
Approx. 20 cm2 /g (FFT: 40 µm)
Coverage
Approx. 20 cm2 /g (FFT: 40 µm)
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
80 - 105 mesh stainless steel screen
Drying Temperature
Level at room temperature for 5 - 10 minutes. Dry at 150 °C for 10 - 20 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 – 12 minutes, and with a total firing cycle time of c. 30 – 60 minutes
Film Thickness
35 – 45 μm