C8728

Description

C8728 is a Ag conductor paste that yields a smooth, dense film on alumina. This material is recommended for general purposes and for large ground plane areas. C8728 provides excellent solderability, void free soldering and good solder leach resistance.

Key Features

Excellent fired film density
#High aged adhesion
#Excellent solderability with Sn62 and Sn95/Ag5

Metal

Ag

Viscosity

90 – 150 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

80 cm2/g at 12 μm fired film thickness

Coverage

80 cm2/g at 12 μm fired film thickness

Storage and Paste Preparation

Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

280 mesh stainless steel screen
0.5 mil emulsion

Drying Temperature

150°C for 10 minutes

Process Temperature (TDS)

850°C peak temperature. Dwell time of 10 – 12 minutes. Total cycle time 36 – 60 minutes.

Film Thickness

Wet: 33 - 37 μm, Dried: 23 - 37 μm, Fired: 10 – 15 μm