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- C8729 (H)
C8729 (H)
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
C8729 (H) is a plateable silver conductor. It exhibits high adhesion. C8729 (H) is an excellent choice for plating applications, such as copper, nickel, etc.
Key Features
Low resistivity
High adhesion
High speed printing
Feed through hole application
High adhesion
High speed printing
Feed through hole application
Metal
Ag
Viscosity
15 – 25 Pa·s (25°C, D = 100/s)
Coverage
c. 80 cm² / g (FFT: 12 µm)
Coverage
c. 80 cm² / g (FFT: 12 µm)
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200 – 325 mesh stainless steel screen.
Total thickness: 50 – 110 µm (incl. emulsion)
Total thickness: 50 – 110 µm (incl. emulsion)
Printing Speed
Up to at least 20 cm / s
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 – 12 minutes, and with a total firing cycle time of c. 30 – 60 minutes
Film Thickness
10 – 15 μm