C8729

Description

C8729 is a plateable silver conductor that yields a smooth, dense film. It exhibits high adhesion on alumina substrates. C8729 can be multiple fired without any loss of performance. C8729 is an excellent choice for electrolytic plating applications, such as copper, nickel, tin, etc.

Key Features

Low resistivity
High adhesion
High speed printing
Feed through hole application

Metal

Ag

Viscosity

15 – 25 Pas
(25 °C, D = 100/s)_x000D_

Coverage

c. 80 cm2
/g
(FFT: 12 µm)

Coverage

c. 80 cm2
/g
(FFT: 12 µm)

Storage and Paste Preparation

Store in a dry, cool
(5 – 25 °C) and dark
place with container
tightly shut

Warranty

6 months

Printing Parameters

200 – 325 mesh screen

Printing Speed

Up to at least 20 cm/s

Drying Temperature

150 °C for 10 – 20 minutes

Process Temperature (TDS)

Fire at 850 °C (peak) for 10 – 12 minutes, and with a total firing cycle time of c. 30 – 60 minutes

Film Thickness

Wet: 32 – 34 µm
Dried: 22 – 26 µm
Fired: 10 – 15 µm