C8731

Description

C8731 is a high solids silver conductor paste designed for hybrid applications utilizing aluminum nitride. It exhibits good solderability and excellent adhesion.

Key Features

Excellent solderability
Excellent adhesion to aluminum nitride

Metal

Ag

Viscosity

150 – 220 Pa·s, Brookfield HBT DVIII, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

200 - 280 mesh stainless steel screen

Drying Temperature

150°C peak temperatureDwell time of 10-15 minutes

Process Temperature (TDS)

850°C peak temperature
Dwell time of 10 minutes

Film Thickness

Wet: 34 - 38 micronsDried: 22 - 26 micronsFired: 14 - 16 microns