C8829D is a low firing silver conductive paste. It was developed for the Celcion® system and exhibits increased solder leach resistance and improved solderability.
Key Features
Low firing temperature Increased solder leach resistance Improved solderability AI wire bondable
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
550 – 570 °C peak temperatureDwell time of 5 – 7 minutes