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- CL49-8217A
CL49-8217A
- Paste Type: Conductor
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
CL49-8217A is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance.
Key Features
Excellent Ag migration resistance
Outstanding leach resistance
Outstanding leach resistance
Metal
AgPdPt
Viscosity
270 – 310 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Coverage
130 cm²/g at 10 μm fired film thickness
Coverage
130 cm²/g at 10 μm fired film thickness
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
850 °C peak temperatureDwell time of 9 – 11 minutes
Film Thickness
6 – 10 μm