CL49-8241

Description

CL49-8241 is a mixed bonded Ag/Pd/Pt conductor material. It offers cost savings over standard Ag/Pd/Pt formulations while maintaining the advantages of leach resistance and aged adhesion. CL49-8241 is supplied with a rheology, which results in a dense, uniform fired film.

Key Features

Low cost
Excellent solderability and leach resistance
Low resistivity
Excellent aged adhesion

Metal

AgPdPt

Viscosity

100 – 170 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Coverage

85 cm2/g at 12 microns fired film thickness

Coverage

85 cm2/g at 12 microns fired film thickness

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 3 months from date of manufacturing with proper storage.

Printing Parameters

280 – 325 stainless mesh screen
0.5 mil emulsion
1.1 mil wire

Drying Temperature

150 °C for 5 to 10 minutes

Process Temperature (TDS)

850 °C peak temperatureDwell time of 9 – 11 minutes

Film Thickness

Dried: 20 – 25 µm Fired: 10 – 15 µm