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- DT1745H
DT1745H
- Paste Type: Component Metallization
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Resistors and Fuses
Details
Description
DT1745H is a lead free Ag paste for front side conductor of chip resistors, with excellent leaching property, acid resistance, adhesion property and electrical characteristics.
Key Features
Excellent leaching property
Excellent acid resistance
Excellent adhesive property
Excellent electrical characteristics
Excellent acid resistance
Excellent adhesive property
Excellent electrical characteristics
Metal
Ag
Viscosity
200 – 400 kcps, Brookfield HBDV–III Ultra, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200- 400 mesh
Polyester or stainless steel screen
Polyester or stainless steel screen
Drying Temperature
130 °C for 15 minutes, with exhaust system 150 °C for 10 minutes
Process Temperature (TDS)
Peak temp：840~860 °C
Dwell time：8~15 minutes
Dwell time：8~15 minutes