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- DT1747H
DT1747H
- Paste Type: Component Metallization
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Resistors and Fuses
Details
Description
DT1747H is a lead free silver paste for frontside conductor of chip-resistors, which with high silver content. DT1747H exhibits excellent solder ability, acid-resistant adhesion and electrical characteristics.
Key Features
Excellent solder ability
Excellent adhesion
Excellent acid-resistant adhesion
Excellent electrical characteristics
Excellent adhesion
Excellent acid-resistant adhesion
Excellent electrical characteristics
Metal
Ag
Viscosity
200 – 400 kcps, Brookfield HBDV–III Ultra, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry, cool (5 - 25°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200- 400 mesh
Polyester or stainless steel screen
Polyester or stainless steel screen
Drying Temperature
130 °C for 15 minutes, with exhaust system 150 °C for 10 minutes
Process Temperature (TDS)
peak temp: 750~850 °C
dwell time:8~15 minutes
dwell time:8~15 minutes