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DT1749L-1
DT1749L-1
Paste Type:
Component Metallization
Substrate:
Alumina (Al2O3)
Application Method:
Screen Printing
Application:
Resistors and Fuses
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Description & Key Features
Description
DT1749L-1 is a lead free silver paste for backside conductor of chip resistors, which with low silver content. DT1749L-1 exhibits excellent leaching property, acid-resistance property, adhesive property and electrical characteristics.
Key Features
Excellent leaching property
Excellent acid-resistant property
Excellent adhesive property
Excellent electrical characteristics
Paste Properties
Metal
Ag
Viscosity
120-180Kcps
BROOKFIELD HBDV-III Ultra
SC4-14 spindle and 6R utility cup @ 10 rpm, 25°C.,
Storage and Paste Preparation
stored in a dry
location at 5°C~25°C.
Allow paste to come to room temperature
prior to opening.
Stirred well before using.
Warranty
6 months
Processing
Printing Parameters
200- 400 mesh
Polyester or stainless steel screen
Drying Temperature
130 °C for 15 minutes, with exhaust system
150 °C for 10 minutes, with exhaust system
Process Temperature (TDS)
Peak temp：840~860 °C
Dwell time：8~15 minutes