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DT1751H
DT1751H
Paste Type:
Component Metallization
Substrate:
Alumina (Al2O3)
Application Method:
Screen Printing
Application:
Resistors and Fuses
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Description & Key Features
Description
DT1751H is a lead free silver paste for frontside conductor of chip-resistors, which with high silver content. DT1751H exhibits excellent solder ability, acid-resistant adhesion and electrical characteristics.
Key Features
Excellent solder ability
Excellent adhesion
Excellent acid-resistant adhesion
Excellent electrical characteristics
Paste Properties
Metal
Ag
Viscosity
200-400 Kcps
BROOKFIELD HBDV-III Ultra
SC4-14 spindle and 6R utility cup @ 10 rpm, 25℃.
Storage and Paste Preparation
stored in a dry
location at 5°C~25°C.
Allow paste to come to room temperature
prior to opening.
Stirred well before using.
Warranty
6 months
Processing
Printing Parameters
200-400 Kcps
BROOKFIELD HBDV-III Ultra
SC4-14 spindle and 6R utility cup @ 10 rpm, 25℃
Drying Temperature
130 °C for 15 minutes, with exhaust system
150 °C for 10 minutes, with exhaust system
Process Temperature (TDS)
peak temp: 750~850 °C
dwell time:8~15 minutes