DT8785

Description

DT8785 is a solderable silver termination paste designed for NTC thermistor bodies. It has a wide firing range with excellent solderability and adhesion using lead free solder. The rheology is suitable for screen printing.

Key Features

Formulated for NTC bodies
Excellent adhesion
Excellent solderability
Wide firing window
Screen printable

Metal

Ag

Viscosity

25 – 35 Pa-s; Paar Physica Rheometer, Parallel Plate (PP50), 1 mm gap, 100/s @ 25°C

Storage and Paste Preparation

Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

280 – 325 mesh stainless steel screen
0.5 mil emulsion

Drying Temperature

150 ºC for 10 - 20 minutes

Process Temperature (TDS)

700 – 800 ºC peak temperature
Dwell time of 10 – 12 minutes at peak

Film Thickness

Wet 32 – 34 µmFired 10 – 12 µm