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- ET1450
ET1450
- Paste Type: End Termination
- Substrate: Other Functional Ceramics
- Application Method: Dipping
- Application: Inductors
Details
Description
ET1450 is a plateable Ag/Pt conductor that yields a smooth, dense film. ET1450 is an excellent choice for plating applications, such as copper, nickel and gold.
Key Features
Plateable
Excellent aged adhesion
Dense fired film
Excellent aged adhesion
Dense fired film
Metal
AgPt
Viscosity
200 – 250 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Process Temperature (TDS)
850 °C peak temperature
Dwell time of 10 – 12 minutes at peak
Total cycle time 36 – 60 minutes
Dwell time of 10 – 12 minutes at peak
Total cycle time 36 – 60 minutes
Film Thickness
10 – 14 μm