ET1801B

Description

ET1801B is a solderable Ag/Pd/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and leach resistance.

Key Features

Suitable rheology for machine dip application
Excellent solderability and leach resistance
Compatible on titanate ceramic bodies

Metal

AgPdPt

Viscosity

30 – 40 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Process Temperature (TDS)

780 – 810 °C at peak temperature Dwell time of 5 – 6 minutes at peak