ET1826

Description

ET1826 is a solderable Ag/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). ET1826 offers excellent solderability and adhesion. ET1826 is supplied at a viscosity suitable for machine dip and blot or no blot applications

Key Features

Suitable rheology for machine dip application
Excellent solderability and adhesion
Compatible on titanate ceramic bodies

Metal

AgPt

Viscosity

25 – 35 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Process Temperature (TDS)

780 – 810 °C at peak temperature Dwell time of 5 – 6 minutes at peak