ET1845A

Description

ET1845A is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1845A offers excellent solderability and adhesion. ET1845A is supplied at a rheology suitable for machine dip application.

Key Features

Suitable rheology for machine dip application
Excellent solderabilit

Metal

Ag

Viscosity

35 – 45 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Drying Temperature

150 ºC peak drying profile10 minutes at peak temperature20 minutes total cycle time

Process Temperature (TDS)

780 ºC peak temperature Dwell time of 4 – 6 minutes