ET1847

Description

ET1847 is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1847 offers excellent solderability and adhesion. ET1847 is supplied at a rheology suitable for machine dip application.

Key Features

Suitable rheology for machine dip application
Excellent solderability

Metal

Ag

Viscosity

15 – 25 kcps, Brookfield RVT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Drying Temperature

150 °C for 10 minutes

Process Temperature (TDS)

650 – 800 °C peak temperature Dwell time of 4 – 6 minutes at peak