ET1847 is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1847 offers excellent solderability and adhesion. ET1847 is supplied at a rheology suitable for machine dip application.
Key Features
Suitable rheology for machine dip application Excellent solderability
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Drying Temperature
150 °C for 10 minutes
Process Temperature (TDS)
650 – 800 °C peak temperature Dwell time of 4 – 6 minutes at peak