ET2854 is a nickel plateable silver end termination designed to be compatible on Multilayer ceramic chips especially on alumina bodies. Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface.
Key Features
Excellent adhesion property after plating Excellent hermeticity
Metal
Ag
Viscosity
40-50 Pas brookfield HBDV-III ultra SC4- 14 spindle and 6R utility cup at 10 rpm, 25 °C
Storage and Paste Preparation
Store in a dry location at 5 – 25 °C
Warranty
6 months
Drying Temperature
150 °C for 8 minutes Peak temp: 175 °C
Process Temperature (TDS)
630- 800°C peak temperature Dwell time of 5 – 7 minutes