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- IP2108
IP2108
- Paste Type: Dielectric / Glaze
- Substrate: Alumina (Al2O3)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
IP2108 is a transparent black firing, lead-free, screen printable, thixotropic overglaze paste for various purposes, especially for protecting thick film resistors or conductors. Because of the high firing temperature, it fires to a very dense glaze layer which is highly passivated to withstand abrasion and aggressive media occurring e.g. in plating processes.
Key Features
High temperature glaze Insulating layers for circuit protection vs moisture and moisture
Metal
None
Viscosity
20 – 40 Pa·s, (25°C, D = 100/s)
Storage and Paste Preparation
Store in a dry, cool (2 - 23°C), dark place with container tightly shut. Allow paste to come to room temperature prior to opening. Spatulate well before using.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
Print through 200 – 325 mesh stainless steel
screen.
screen.
Drying Temperature
Dry at 150 °C for 10 minutes.
Process Temperature (TDS)
Fire at 850 °C (peak) for 10 – 12 minutes, and with a total firing cycle time of c. 30 – 60 minutes