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- IP9002
IP9002
- Paste Type: Dielectric / Glaze
- Substrate: Aluminum Nitride (AlN)
- Application Method: Screen Printing
- Application: Hybrid IC
Details
Description
IP9002 is a Pb, Cd, and Ni free low firing green overglaze that is resistant to various plating solutions. It has a low thermal expansion coefficient allowing for applications which utilize aluminum nitride substrates. It is compatible with various Heraeus conductors designed for aluminum nitride.
Key Features
Excellent plating solution resistance Pinhole free Low thermal expansion coefficient (CTE) Chemically durable
Metal
None
Viscosity
60 – 80 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Coverage
170 cm2/g at 25 μm wet film thickness
Coverage
170 cm2/g at 25 μm wet film thickness
Storage and Paste Preparation
Store in a dry location at 20 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
TBD
Printing Parameters
Excellent plating solution resistance
Pinhole free
Low thermal expansion coefficient (CTE)
Chemically durable
Pinhole free
Low thermal expansion coefficient (CTE)
Chemically durable
Printing Speed
Drying Temperature
Allow to level for 10 minutes before drying
150 ºC for 10 minutes
150 ºC for 10 minutes
Process Temperature (TDS)
500 – 600 °C peak temperature Dwell time of 5 – 7 minutes
Film Thickness
Dried: 20 - 22 µm
Fired: 8 - 12 µm
Fired: 8 - 12 µm