Expansion coefficient is closely matched with that of alumina, to provide for minimal substrate bowing Extremely dense, hermetic fired film allows for excellent electrical performance at a fired thickness of ≥ 40 μm Excellent solderability and adhesion of Ag. Ag/Pd, Ag/Pt, Au and Au/Pt conductors on top of dielectric Excellent wire bondability of gold conductors on top of dielectric Resistors can be processed on top of dielectric Absence of the “Battery Effect”3