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- PCC11866
PCC11866
- Paste Type: Component Metallization
- Substrate: PZT, NTC Ceramics, Alumina (Al2O3), Steatite, Porcelain
- Application Method: Screen Printing
- Application: Piezo, Component Metallization
Details
Description
PCC11866 is a lead and cadmium free low
temperature firing silver paste designed to screen
print solderable electrodes onto a variety of
electrical ceramic component devices. The fired
film forms a highly adherent bond to many types of
substrates, including piezoelectric transducers
(PZTs), NTC thermistors, alumina, steatite, and
porcelain. The metalized electrode is solderable for
external lead attachment.
temperature firing silver paste designed to screen
print solderable electrodes onto a variety of
electrical ceramic component devices. The fired
film forms a highly adherent bond to many types of
substrates, including piezoelectric transducers
(PZTs), NTC thermistors, alumina, steatite, and
porcelain. The metalized electrode is solderable for
external lead attachment.
Key Features
Lower firing temperature (< 700 ºC)
Designed for piezoelectric transducers (PZTs),
NTC thermistors, alumina, steatite, and porcelain substrates.
Designed for piezoelectric transducers (PZTs),
NTC thermistors, alumina, steatite, and porcelain substrates.
Metal
Ag
Viscosity
80 – 100 kcps, Brookfield HBT, SC4-14 spindle & 6R utility cup @ 10 rpm, 25°C
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
60 – 200 stainless steel mesh screens
0.7 – 1.0 mil emulsion
Screens can be cleaned using common solvents such
as isopropyl alcohol or acetone.
0.7 – 1.0 mil emulsion
Screens can be cleaned using common solvents such
as isopropyl alcohol or acetone.
Drying Temperature
150 ºC for 10 minutes
Process Temperature (TDS)
Optimum firing parameters depend on
substrate composition
650 – 700 ºC peak firing temperature
Dwell time of 8 – 12 minutes
Total cycle time of 45 – 60 minutes
substrate composition
650 – 700 ºC peak firing temperature
Dwell time of 8 – 12 minutes
Total cycle time of 45 – 60 minutes
Film Thickness
9 – 15 µm