PCC11913

Description

PCC11913 is a Pb and Cd free low temperature
firing silver paste designed to screen print
solderable electrodes onto a variety of electrical
ceramic component devices. The fired film forms a
highly adherent bond to many types of substrates,
including piezoelectric transducers (PZTs), NTC
thermistors, alumina, steatite, and porcelain. The
metalized electrode is readily solderable for
external lead attachment.

Key Features

Lower firing temperature (< 700 ºC)

Metal

Ag

Viscosity

80 – 100 kcps, Brookfield HBT, SC4-14 spindel & 6R utility cup @ 10 rpm, 25°C

Storage and Paste Preparation

Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.

Warranty

Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.

Printing Parameters

80 – 200 stainless steel mesh screens
0.7 – 1.0 mil emulsion
Allow parts to level at room temperature before
drying

Drying Temperature

150 ºC for 10 - 15 minutes

Process Temperature (TDS)

Optimum firing parameters depend on
substrate composition
650 – 700 ºC peak firing temperature
Dwell time of 8 – 12 minutes
Total cycle time of 45 – 60 minutes
Larger parts may require a longer firing
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Film Thickness

9 – 15 µm