PCC11970 is a Pb and Cd free palladium silver conductor composition designed for use in the manufacture of hybrid circuitry. PCC11970 employs a mixed oxide and glass bonding system that results in a dense, solderable fired film with high initial and aged adhesion.
Key Features
Solderable fired films Excellent initial and aged adhesion
70-75 cm2 /gm (calculated from 50 micron wet film)
Coverage
70-75 cm2 /gm (calculated from 50 micron wet film)
Storage and Paste Preparation
Store in a dry location at 5 – 25°C. DO NOT REFRIGERATE. Allow paste to come to room temperature prior to opening. Spatulate well before using, as settling may occur during storage.
Warranty
Material guaranteed to meet specifications for 6 months from date of manufacturing with proper storage.
Printing Parameters
200 - 325 mesh stainless steel screen 0.5 mil emulsion Allow parts to level at room temperature for 1 – 3 minutes before drying.
Printing Speed
≤ 25 cm/sec. (10 in/sec)
Drying Temperature
150°C for 5 - 10 minutes.
Process Temperature (TDS)
850°C peak temperature Dwell time of 10 minutes at peak