Large Area Sintering (LAS) is on the verge of becoming the new connection technology for the next generation of high power, high efficiency, and high reliability inverters.
First presented at the ECCE Europe 2024 in Darmstadt, Germany beginning of September 2024 this interesting study on thermal shock temperature lifetime modeling has also been published in SMT Today in October 2024.
The paper investigates the potential of novel large-area sintered silver pastes for establishing highly reliable interconnections between baseplates and metal ceramic substrates. The evaluation of advanced AMB substrates (Condura®.prime) and cost-effective counterpart Condura®.ultra (AMB2.0) demonstrates comparable Temperature Shock Test (TST) performance.
The study also highlights the potential for sintered attachments to outlast conventional soldered connections by up to 30 times and provides valuable insights for the advancement of interconnection technologies in metal ceramic substrates.
